Research on Heat Distribution of Semiconductor Baking Process
In the field of semiconductors,heat treatment technology has been widely applied.The temperature uniformity of the hot plate during the baking process directly affects the quality of wafer heat treatment.This article will conduct in-depth research on the application of heat treatment in the field of semiconductor baking.This article takes the cavity structure containing wafers as the research object,and elaborates on the wafer surface temperature distribution and influencing factors from the aspects of structural design,simulation analysis,and algorithm control.During the simulation process,some holes and support columns that have little impact on the results are removed,thereby simplifying the simulation model and setting the power of each region separately.In terms of temperature control,a multi-zone temperature control method is used for PID algorithm control.
bakingtemperature uniformitystructural designalgorithm control
万方数据
维普
