首页|聚醚类添加剂在5 μm极薄电解铜箔制备中的影响

聚醚类添加剂在5 μm极薄电解铜箔制备中的影响

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通过电化学、扫描电镜、X射线衍射仪研究了聚醚类添加剂对5 μm极薄锂电铜箔性能的影响.结果表明,电解液中添加聚醚类添加剂能促使铜的沉积电位负移;适宜质量浓度的聚醚类添加剂能细化铜箔晶粒,有利于提高铜箔表面平整性;聚醚类添加剂质量浓度2.3 mg/L时,所得铜箔抗拉强度620.43 MPa,延伸率3.67%,光泽度161 GU,毛面粗糙度1.02 μm,综合性能极好;高抗拉强度电解铜箔具有(111)晶面择优取向特征.
Effect of Polyether Additives in Preparation of Ultra-thin Electrolytic Copper Foil(5 μm)
The influence of polyether additives on performance of ultra-thin Li-ion battery copper foil with thickness of 5 μm was studied by electrochemistry,scanning electron microscopy,and X-ray diffractometer.The results show that addition of polyether additives into electrolyte can promote negative shift of Cu deposition potential,and polyether additives with suitable concentration can lead to finer grains of copper foil,which is conducive to improving the surface flatness of copper foil.When the mass concentration of polyether additives is 2.3 mg/L,the obtained copper foil has tensile strength of 620.43 MPa,elongation of 3.67%,glossiness of 161 GU,and surface roughness of 1.02 μm,presenting excellent overall performance.The electrolytic copper foil with high tensile strength has a preferred orientation of(111)plane.

Li-ion battery copper foilpolyether additiveelectrochemistrytensile strengthelongationglossinessroughness

姬琳、樊斌锋、王庆福、李伟涛

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河南高精铜箔产业技术研究院有限公司,河南灵宝 472500

锂电铜箔 聚醚类添加剂 电化学 抗拉强度 延伸率 光泽度 粗糙度

河南省重点研发专项

231111241000

2024

矿冶工程
长沙矿冶研究院有限责任公司 中国金属学会

矿冶工程

CSTPCD北大核心
影响因子:1.137
ISSN:0253-6099
年,卷(期):2024.44(4)