低热膨胀系数聚酰亚胺薄膜的制备方法研究
Study on Preparation Methods of Polyimide Films With Low Coefficient of Thermal Expansion
史恩台 1潘成 1胡程鹏1
作者信息
- 1. 安徽国风新材料股份有限公司,安徽 合肥 230088
- 折叠
摘要
以 4,4'-二氨基-2,2'-二甲基联苯(M-Tol)、对苯二胺(PDA)、3,3',4,4'-联苯四甲酸二酐(BPDA)三种单体在极性溶剂中聚合得到聚酰胺酸溶液,经涂布、亚胺化制备聚酰亚胺薄膜,利用热机械分析仪和万能试验机对薄膜进行性能表征,研究聚合物组成、共聚结构、反应溶剂、亚胺化工艺、拉伸条件对聚酰亚胺薄膜热膨胀系数和机械性能的影响.研究发现,M-Tol、PDA、BPDA摩尔比为2∶8∶10,拥有嵌段共聚结构、采用高沸点反应溶剂与化学亚胺化工艺、经过拉伸的聚酰亚胺薄膜具有更低的热膨胀系数和更优秀的机械性能.
Abstract
Polyamidic acid solution was obtained by polymerization of three monomers including 4,4'-diamino-2,2'-dimethylbiphenyl(M-Tol),p-phenylenediamine(PDA)and 3,3',4,4'-biphenyltetracarboxylic dianhydride(BPDA)in polar solvent.Polyimide films were prepared by coating and imidization.The performances of the films were characterized by thermo mechanical analyzer and universal testing machine,and effects of polymer composition,copolymer structure,reaction solvent,imidization process and stretching on the coefficient of thermal expansion and mechanical properties of polyimide films were studied.It was found that the stretched polyimide films with block copolymer structure prepared by high boiling reaction solvent and chemical imidization process under the molar ratio of M-Tol,PDA and BPDA of 2∶8∶10 had lower coefficient of thermal expansion and better mechanical properties.
关键词
聚酰亚胺薄膜/热膨胀系数/聚酰胺酸/亚胺化/机械性能Key words
Polyimide film/Thermal expansion coefficient/Polyamic acid/Imidization/Mechanical properties引用本文复制引用
出版年
2024
NETL
NSTL
维普
万方数据