聚酰亚胺薄膜制备高导热石墨烯膜影响因素研究
Study on Influencing Factors of Preparation of Graphene Film With High Thermal Conductivity by Polyimide Film
方超 1孙善卫 1史恩台 1潘成1
作者信息
- 1. 安徽国风新材料股份有限公司,安徽 合肥 230000
- 折叠
摘要
研究了使用聚酰亚胺薄膜作为前驱体,通过1 200℃真空碳化和2 800℃氩气保护石墨化制备出高导热系数的石墨烯膜,并研究了对苯二胺含量、薄膜拉伸比例、薄膜厚度和导热填料的加入对石墨烯薄膜导热系数和拉伸强度的影响.结果显示在不添加导热填料时,38 μm的聚酰亚胺膜烧制的石墨烯膜导热系数为1 298 W·m-1·K-1,拉伸强度为30 MPa;添加5%的粒径为1 μm的氧化铝,石墨烯膜的导热系数可达1 278 W·m-1·K-1,拉伸强度可达66 MPa.
Abstract
High thermal conductivity graphene films were prepared by vacuum carbonization at 1 200℃ and argon protected graphitization at 2 800℃ using polyimide films as precursors.The effects of p-phenylenediamine content,film stretching ratio,film thickness and the addition of thermal conductive filler on the thermal conductivity and tensile strength of graphene films were also studied.The results showed that the thermal conductivity of graphene film prepared by 38 μm polyimide film without adding thermal conductive filler was 1 298 W·m-1·K-1,and the tensile strength was 30 MPa;Adding 5％alumina with particle size of 1 μm,the thermal conductivity of graphene film could reach 1 278 W·m-1·K-1,and the tensile strength could reach 66 MPa.
关键词
聚酰亚胺/石墨烯膜/导热系数/拉伸强度/对苯二胺/氧化铝Key words
Polyimide/Graphene film/Thermal conductivity/Tensile strength/Phenylenediamine/Alumina引用本文复制引用
出版年
2024
NETL
NSTL
维普
万方数据