Study on Influencing Factors of Preparation of Graphene Film With High Thermal Conductivity by Polyimide Film
High thermal conductivity graphene films were prepared by vacuum carbonization at 1 200℃ and argon protected graphitization at 2 800℃ using polyimide films as precursors.The effects of p-phenylenediamine content,film stretching ratio,film thickness and the addition of thermal conductive filler on the thermal conductivity and tensile strength of graphene films were also studied.The results showed that the thermal conductivity of graphene film prepared by 38 μm polyimide film without adding thermal conductive filler was 1 298 W·m-1·K-1,and the tensile strength was 30 MPa;Adding 5%alumina with particle size of 1 μm,the thermal conductivity of graphene film could reach 1 278 W·m-1·K-1,and the tensile strength could reach 66 MPa.