Effect of Sputtering Pressure on Bonding Properties of Copper Based Composite Films
By DC magnetron sputtering,chromium,cobalt and titanium films were deposited on the copper foil substrate with nickel coating by changing the sputtering pressure of the equipment,and then copper films were prepared on the three kinds of films by water electroplating.The results showed that,with the increase of sputtering pressure,the surface energy of chromium thin films first decreased and then increased until the pressure was 0.8 Pa,and the surface energy of cobalt thin films first increased and then decreased,the change trend of surface energy of both films occurred at a pressure of 0.5 Pa,and the surface energy of titanium films remained unchanged.The binding force of chromium and cobalt thin films remained unchanged at 0.3～0.5 Pa and then began to decrease.The binding force of titanium thin films first increased and then decreased,and a transition occurred at 0.5 Pa.
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