Research on Vibration Fatigue Lives of Pin Solder Joints on Vehicle-Mounted Power Module Under Electric-Thermal-Solid Coupling
The reliability of pin solder joints on vehicle-mounted power module under the combined effects of heat generated by power loss and random vibration caused by road bump was explored.Fatigue life simulations of pin solder joints under electric-thermal-solid coupling were performed using the multi-physics field finite element models.The stress distribution and fatigue damage of the random vibration response were obtained for both elevated and normal temperature conditions.Furthermore,theoretical fatigue lives were also predicted and contrasted using empirical-based Dirlik model and Miner linear cumulative damage rule.The results show that the vibration fatigue life of solder joints decreases significantly considering electric-thermal-solid coupling effect due to the decrease of local constraint rigidity and the increase of vibration stress of solder joints,nevertheless still meets the specified vibration requirement.Finally,the accuracy of analysis results and the reliability of structural design were verified through conducting the vibration failure tests under full-power heating condition.
electric-thermal-solid couplingsolder jointsrandom vibration responsefatigue life estimationtest verification
万方数据
维普
