Strengthening mechanisms in heterostructured copper films with highly(220)-oriented vertical nanotwins
韦小丁 1张鹏 2马瑜薇 1刘俊杰 3於中良 4丛超男5
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作者信息
1. State Key Laboratory for Turbulence and Complex System,Department of Mechanics and Engineering Science,College of Engineering,Peking University,Beijing 100871,China
2. State Key Laboratory for Turbulence and Complex System,Department of Mechanics and Engineering Science,College of Engineering,Peking University,Beijing 100871,China;Institute for Advanced Materials and Technology University of Science and Technology Beijing,Beijing 100083,China
3. Department of Engineering Mechanics,Beijing University of Technology,Beijing 100124,China
4. College of Mechanical Engineering,Yangzhou University Yangzhou 225127,China
5. College of Science,China Agricultural University,Beijing 100083,China
In this study,heterostructured copper films containing different proportions of highly(220)-oriented vertical nanotwins were prepared by direct current(DC)electroplating.Uniaxial tensile tests showed that the mechanical properties improved notably when the volume ratio of the vertical nanotwins increased-the film with the 88％vertical twins exhibited the ultimate tensile strength of 455 MPa,approximately 83％higher than those of the equiaxed Cu films.Postmortem electron microscopy characterizations,assisted by molecular dynamics simulations,revealed that these special heterostructures of the equiaxed grains and vertical nanotwins facilitated the activation of multi-mode slip systems.The activation of multi-mode slip systems leads to higher dislocation density,thus endowing the material with enhanced mechanical strength and work hardening rate without significant loss of ductility.
关键词
DC Electrodeposition/Vertical twins/Mechanical properties/Dislocation mechanism
Key words
DC Electrodeposition/Vertical twins/Mechanical properties/Dislocation mechanism
维普
万方数据