首页|Ni镀层对Cu/Al钎焊接头界面组织与力学性能的影响

Ni镀层对Cu/Al钎焊接头界面组织与力学性能的影响

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为探究Ni-P镀层对Cu/Al异种金属钎焊界面反应的影响,采用化学镀方法对T2紫铜进行化学镀镍处理,使用BAl88Si药芯钎料通过感应钎焊方法钎焊Cu/Al接头.采用扫描电子显微镜和电子背散射衍射技术对接头进行微观组织观察与物相分析,并对接头进行力学性能测试,分析镀层对Cu/Al接头微观组织结构及力学性能的影响,探讨钎焊过程中不同钎焊接头的界面形成机理.结果表明:无镀层接头在界面处形成了Cu9Al4和CuAl2两层金属间化合物,有镀层接头界面处形成了 Al2Ni和Al3Ni金属间化合物.无镀层接头的抗拉强度可达56.4 MPa,优于有镀层接头.接头均发生脆性断裂,断裂位置从无镀层接头的CuAl2和a-Al固溶体的界面处转变为有镀层接头的Al3Ni金属间化合物处.
Effect of Ni-P Coating on Microstructure and Mechanical Properties of Cu/AI Brazed Joints
To investigate the effect of Ni-P coating on the interfacial reactions in Cu/Al dissimilar metal brazing,a chemical plating method was employed to nickel plate T2 copper,followed by brazing of the Cu/Al joints using the induction brazing technique with BA188Si flux-cored filler metal.Scanning electron microscopy and electron backscatter diffraction were utilized for microstructural observation and phase analysis of the joints.Mechanical testing was performed to analyze the influence of the coating on the microstructure and mechanical properties of the Cu/Al joints,while also exploring the interface formation mechanism of different brazing joints during the brazing process.The results reveal the formation of intermetallic compounds Cu9Al4 and CuA12 at the interface of uncoated joints,whereas intermetallic compounds Al2Ni and Al3Ni are formed at the interface of the coated joints.The tensile strength of uncoated joints reaches to 56.4 MPa,outperforming that of coated joints.Brittle fractures occurre in all joints,with the fracture location transitioning from the interface of CuAl2 and the a-Al solid solution in uncoated joints to the Al3Ni intermetallic compound in coated joints.

Cu/Al dissimilar metalsNi-P coatingintermetallic compoundsmicrostructuremechanical property

张学智、黄玲玲、李云鹏、于卓立、曹新娜、宋路阳、安鹏涛、魏世忠

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河南科技大学金属材料磨损控制与成型技术国家地方联合工程研究中心,河南 洛阳 471023

河南科技大学材料科学与工程学院,河南 洛阳 471023

郑州机械研究所有限公司新型钎焊材料与技术国家重点实验室,河南郑州 450001

Cu/Al异种金属 Ni-P镀层 金属间化合物 微观组织 力学性能

国家自然科学基金项目河南省科技厅自然科学基金项目河南省科技攻关计划

U2341258232300420088222103810032

2024

河南科技大学学报(自然科学版)
河南科技大学

河南科技大学学报(自然科学版)

CSTPCD北大核心
影响因子:0.673
ISSN:1672-6871
年,卷(期):2024.45(4)