首页|基于Moldflow及正交试验的箱包下底盘注塑工艺参数优化

基于Moldflow及正交试验的箱包下底盘注塑工艺参数优化

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以某箱包下底盘为研究对象,采用Moldflow与正交试验相结合的方法,对其进行注塑成型数值模拟分析.以熔体温度、注射时间、保压压力、保压方式和模具温度为试验因素,分析其对翘曲变形量的影响规律,旨在找到最佳的工艺参数组合以获取最小翘曲变形量.结果表明,各因素对翘曲变形影响由大到小依次为:保压压力,熔体温度,保压方式,注射时间,模具温度.用优化后的工艺参数组合再次模拟得到的翘曲变形量为0.8768 mm,与用默认工艺得到的1.404 mm相比,降幅为36%,为实际注塑工艺参数的设置提供了理论指导.
Optimization of injection molding parameters for lower chassis of luggage based on moldflow and orthogonal test
Taking the lower chassis of a bag as the research object,the injection molding numerical simulation analysis was carried out by using Moldflow and orthogonal test method.The effects of melt temperature,injection time,packing pressure,packing mode and mold temperature on the warpage were analyzed in order to find the best combination of process parameters to obtain the minimum warpage.The results showed that the influence degree of each factor on warpage deformation was as follows:packing pressure>melt temperature>packing method>injection time>mold temperature.The warpage deformation was 0.876 8 mm,which was 36%lower than the default process of 1.404 mm.It provided a theoretical guidance for the setting of the actual injection process parameters.

Moldfloworthogonal testparameter optimizationwarping Deformation

李兴俊、张英本、余健、姜松涛、许青青

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嘉兴南洋职业技术学院,浙江 嘉兴 314031

浙江协同光电科技有限公司,浙江 嘉兴 314031

Moldflow 正交试验 参数优化 翘曲变形

浙江省产学合作协同育人项目

2023241-411

2024

模具技术
上海交通大学

模具技术

CSTPCD
影响因子:0.219
ISSN:1001-4934
年,卷(期):2024.(5)