摘要
聚酰亚胺(PI)膜材料热膨胀系数(CTE)的可控调节在半导体制造、芯片封装以及柔性显示等领域具有十分重要的意义.本研究从CTE原理出发,总结了在分子水平和凝聚态水平对PI膜CTE的调节方法.着重考察了分子主链结构、序列结构、取代基结构、共聚、分子内/间相互作用、交联等分子链结构改变以及引入无机纳米颗粒、共混、取向、控制PI薄膜相转化过程、调控PI薄膜的制备等凝聚态结构对PI膜CTE的影响以及研究进展进行总结.并对低CTE的PI膜材料的调控的未来发展趋势进行展望.
Abstract
It's of great significance to fine tuning the thermal expansion coefficient(CTE)of polyimide membranes due to its wide applications in chip manufacture,integrated circulate encapsulation,and organic light emitting devices.Here,we summarized the recently reported literatures for regulating the CTE of polyimide membranes from molecular level and condensation states.By starting from the principle of CTE,we focus on the main chain structures,chain connecting sequence,substitutions,copolymerization,intra-and inter-molecular interactions,crosslinking that change the polyimide chain from the molecular structures to their CTE values.At the same time,we also summarized the doping,blending,alignment,membrane formation process and imidization methods that can tune their CTE from the condensation states.At last,we summarized the future directions for low CTE polyimide membranes and their plausible regulating methods.
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