Progress and application of adhesives in electronic encapsulation field
Several electronic encapsulation materials are introduced in this paper, such as epoxy resin, polyurethane, silicon rubber.And the advantage, disadvantage and applications of the materials are showed.A new packaging technology□low pressure injection molding with polyamide hot melt adhesives is referred as a focal point.
electronic encapsulationepoxy resinpolyurethanelow pressure injection moldingpolyamide hot melt adhesive
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