To study and improve the thermal conductivity of copper foam,different solvents were used to dissolve the mixed solution of graphene oxide.Graphene oxide(GO)was attached to the surface of pretreated copper foam by two different deposition methods of mechanical deposition and electrodeposition.Then,by using a high-temperature reduction method,the excess oxygen-containing functional groups on the surface of graphene oxide were removed,and it was reduced to reduced graphene oxide(rGO).The thermal conductivity of the material and the existence of rGO on the surface of copper foam were studied.The results show that the deposition layer on the surface of copper foam deposited by GO-anhydrous ethanol-acetone mixed solution is the most uniform and complete,and the performance improvement is also the most obvious after high temperature reduction.The low temperature thermal diffusion coefficient is increased by 95.5%,from 29.06 mm2/s of pure copper foam to 56.81 mm2/s.Compared with T2 copper sheet with thermal diffusivity of 50.26 mm2/s,its thermal diffusivity is also increased by 13.09%.The deposition method of GO on the surface of copper foam has a significant effect on the deposition effect.After high temperature reduction of GO to rGO,the thermal conductivity of copper foam can be effectively improved.
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