首页|Status of research on non-conventional technology assisted single-point diamond turning

Status of research on non-conventional technology assisted single-point diamond turning

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With the increasing use of difficult-to-machine materials in aerospace applications,machining requirements are becoming ever more rig-orous.However,traditional single-point diamond turning(SPDT)can cause surface damage and tool wear.Thus,it is difficult for SPDT to meet the processing requirements,and it has significant limitations.Research indicates that supplementing SPDT with unconventional tech-niques can,importantly,solve problems due to the high cutting forces and poor surface quality for difficult-to-machine materials.This paper first introduces SPDT and reviews research into unconventional techniques for use with SPDT.The machining mechanism is discussed,and the main advantages and disadvantages of various methods are investigated.Second,hybrid SPDT is briefly described,which encompasses ultrasonic-vibration magnetic-field SPDT,ultrasonic-vibration laser SPDT,and ultrasonic-vibration cold-plasma SPDT.Compared with the traditional SPDT method,hybrid SPDT produces a better optical surface quality.The current status of research into unconventional tech-niques to supplement SPDT is then summarized.Finally,future development trends and the application prospects of unconventional assisted SPDT are discussed.

Single-point diamond turningMachined surface qualityTool wearUnconventional auxiliary technique

Zhuang Chen、Guangjun Chen、Zhiwei Yu、Jiashuai Huang、Hong Wei

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Tianjin Key Laboratory of High Speed Cutting and Precision Processing,Tianjin 300222,China

School of Mechanical Engineering,Tianjin University of Technology and Education,Tianjin 300222,China

National Natural Science Foundation of ChinaNatural Science Foundation of Tianjin of ChinaScientific Research Project of Tianjin Municipal Education Commission

5217543122JCZDJC007302022ZD021

2023

纳米技术与精密工程(英文)
中国微米纳米技术学会,天津大学

纳米技术与精密工程(英文)

CSTPCDCSCDEI
影响因子:0.476
ISSN:1672-6030
年,卷(期):2023.6(3)
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