Simulation Analysis of Microstructure Molding by Non-isothermal Hot Embossing of Microfluidic Chips
In traditional hot embossing,the microfluidic were imprinted by the mold and substrate which requires to be heated to a certain temperature,the process costs a long cycle time and low efficiency because of heating and cooling repeatedly.In this paper,the finite element method is used to analysis the law of forming when microfluidic chips were imprinted under non-isothermal conditions.According to the simulation analysis,when the mold temperature is higher than the substrate temperature,the substrate can balance with the mold temperature in a short time through heat transfer,and extending the imprinting time can reduce the stress concentration of the substrate.When the mold temperature is lower than the substrate temperature,but both are higher than the glass transition temperature,the microstructure imprinting process can achieve the effect of imprinting and cooling simultaneously,shortening the imprinting cycle.Through the analysis of the microstructure imprinting error,it can be seen that under a fixed mold temperature,the relative error of the microchannel depth is the largest.As the mold temperature increases,the overall molding quality of the microchannel first increases and then decreases,with the smallest error occurring at 120 ℃.
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