Advances of Creep Behavior and Uncouple Constitutive Theory of Solder Alloy
As the miniaturization design of aerospace instruments,the instruments service in a tough environment with more and more complex loading.Solder joints,lead and other package structure is the weak link and the consequence of its failure is very serious,which may cause device damages.In order to improve the environmental adaptability and reliability of the package structures,the materials properties of solder alloy and the constitutive model should be investigated.In this paper,the investigation status of creep properties and uncouple constitutive model in recent years were reviewed comprehensively.Prediction capabilities of different constitutive models were discussed in details,which was beneficial for understanding of creep behavior of solder alloy.
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维普
