Micro-interconnection and 3D packaging technology promote the rapid development of aerospace electronic products to high-performance and miniaturization.As the weak link of package structure,solder joints develop from millimeter to micron,which enhance the severity of solder joints failure.In order to improve the reliability of the package structure,it is essential to investigate the failure mechanism and life prediction model of solder joints.In this paper,the basic theory of creep fatigue life prediction and life prediction models of solder joints were summarized.Prediction capabilities of life prediction models were analyzed,which was important to improve the understanding of life prediction theory under creep fatigue conditions,and establish the life prediction model with high accuracy and applicability.
万方数据
维普
