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硅片盒喷雾清洗装置设计

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为减少在半导体产业中因硅片盒洁净度引起的硅片清洗质量问题,提高硅片盒清洗效率并减少化学液用量,课题组设计了一种硅片盒喷雾清洗装置.该装置采用上部喷雾、下部浸入的化学液湿法清洗方式,结合雾化理论对喷嘴结构进行了参数设计,并对化学液喷雾硅片盒清洗机的骨架、槽体和化学液喷雾装置进行建模及仿真分析.研究结果表明:该装置在保证清洗效果的前提下,可以避免因硅片盒洁净度的不足而影响硅片的表面质量,同时减少了化学液的用量和废气的排放.该设计为硅片盒清洗提供了一种更高效且经济的参考方案.
Design of Silicon Wafer Box Spray Cleaning Device
In order to reduce silicon wafer cleaning quality problems caused by silicon wafer box cleanliness in the semiconductor industry,improve the cleaning efficiency of silicon wafer boxes,and minimize the use of chemical liquid,a silicon wafer box spray cleaning device was designed.The device structure was designed by wet cleaning with upper spray and lower immersion chemical liquid.The design parameters of the spray nozzle structure were calculated based on atomization theory;The skeleton,tank and spray device of chemical liquid silicon wafer box spray cleaning device were modeled and simulated.The research results show that the device can minimize the quantity of chemical liquid and exhaust gas emissions while maintaining the cleaning effect,and prevent wafer surface quality from being impacted by inadequate silicon wafer box cleanliness.This design provides a more efficient and economical reference solution for cleaning silicon wafer boxes.

silicon wafer boxspray cleaning deviceatomizationspray nozzlefluid simulation

葛正浩、杨昊、李理想、李杰、蔡永礼

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陕西科技大学机电工程学院,陕西西安 710021

思恩半导体科技(苏州)有限公司,江苏苏州 215000

硅片盒 喷雾清洗装置 雾化 喷嘴 流体仿真

安徽省科技重大专项项目

2022e0302002

2024

轻工机械
中国轻工机械协会,中国轻工业机械总公司,轻工业杭州机电设计研究院

轻工机械

CSTPCD
影响因子:0.465
ISSN:1005-2895
年,卷(期):2024.42(5)
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