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智能手机窄边框技术发展概述与COP工艺设计改善

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该文针对智能手机等电子产品中全面屏极窄边框技术的发展历程和核心问题进行详细的概括和探讨,从而进一步寻找未来智能手机发展的突破点。从多个方面来进行论述,提出一系列设计和工艺上的改进与探索方法,首先从传统的屏幕封装方式入手,对比COG、COF、COP等模组工艺,又介绍现有工艺中的技术难题和提升方向,最后针对性地提出和总结针对柔性OLED屏幕的COP工艺设计提升的技术路径和方案,特别是从弯折区金属层叠应力设计优化、弯折区机械可靠性抗冲击强度提升、无弯折半径的全新工艺等方面提出设计解决方案,为极窄边框显示技术的发展指明方向。
This article provides a detailed overview and discussion of the development process and core issues of the full-screen narrow-bezel technology in smartphones and other electronic products,in order to further identify breakthroughs for the future development of smartphones.The discussion is conducted from multiple aspects,and a series of design and process improvement and exploration methods are proposed.Firstly,starting from the traditional screen packaging method,the comparison of COG,COF,COP and other module processes is made.And then,the technical difficulties and improvement directions in existing processes are introduced.Finally,the technical path and solution for improving the COP process design for flexible OLED screens are proposed and summarized,especially from the aspects of bending area metal stacking stress design optimization,bending area mechanical reliability impact strength improvement,and new processes without bending radius.The design solutions are proposed for the development of extremely narrow frame display technology,which points out the direction for the development of this technology.

extremely narrow frame technologydisplay technologyChip On PI(COP)bending areastress designimpact resistance improvementno bending radius

李晨、李阳、王孟禾、李硕

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北京首卫保安服务有限公司,北京 100000

山东仁仁健康科技有限公司,山东 临沂 276000

荣耀终端有限公司,北京 100000

首都航天机械有限公司,北京 100000

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极窄边框技术 显示技术 Chip On PI(COP) 弯折区 应力设计 抗冲击强度提升 无弯折半径

2025

科技创新与应用
黑龙江省报刊出版有限公司 黑龙江省科协技术协会

科技创新与应用

影响因子:0.993
ISSN:2095-2945
年,卷(期):2025.15(2)