This article provides a detailed overview and discussion of the development process and core issues of the full-screen narrow-bezel technology in smartphones and other electronic products,in order to further identify breakthroughs for the future development of smartphones.The discussion is conducted from multiple aspects,and a series of design and process improvement and exploration methods are proposed.Firstly,starting from the traditional screen packaging method,the comparison of COG,COF,COP and other module processes is made.And then,the technical difficulties and improvement directions in existing processes are introduced.Finally,the technical path and solution for improving the COP process design for flexible OLED screens are proposed and summarized,especially from the aspects of bending area metal stacking stress design optimization,bending area mechanical reliability impact strength improvement,and new processes without bending radius.The design solutions are proposed for the development of extremely narrow frame display technology,which points out the direction for the development of this technology.