首页|全球主要经济体半导体领域面向未来的战略布局及对中国的启示

全球主要经济体半导体领域面向未来的战略布局及对中国的启示

扫码查看
全球经济体对半导体产业的重视程度日益加深,纷纷出台相关政策与战略措施等加强对半导体产业发展的支持.分析主要经济体在半导体领域的战略布局、战略规划,有助于中国把握半导体行业的发展先机,获取国际竞争优势.通过梳理美国、欧盟、日本和韩国等经济体2023 年以来在半导体领域的政策规划,总结各国重点布局的方向、特点和规律.研究发现,各经济体主要在战略、投资、供应链和技术管制层面进行布局,美国在半导体领域展开全面布局与多维度合作,欧盟在供应链安全及技术创新层面加强布局:日本积极促进供应链多元化并注重提升产业竞争力,韩国全面推动半导体产业发展与技术创新.基于以上发现,提出了全球经济体在半导体领域的布局给中国带来的启示.
Future-oriented Strategic Layout and Inspiration in the Semiconductor Field of the World's Major Economies
The global economies are increasingly focusing on the semiconductor industry,introducing policies and strategies to strengthen the support for the development of the semiconductor industry.Familiarizing with the strategic layouts and planning of major economies in the semiconductor field helps China to grasp the development opportunities of the semiconductor industry and gain international competitive advantages.By reviewing the policy planning of economies such as the United States,the European Union,Japan,and South Korea in the semiconductor field from 2023,the focus,characteristics,and patterns of each country's layout are summarized.The research found that various economies mainly lay out strategies,investments,supply chains,and technology controls.The United States carries out a comprehensive layout and multi-dimensional cooperation in the semiconductor field,the European Union strengthens the layout in supply chain security and technological innovation,Japan actively promotes supply chain diversification and focuses on enhancing industrial competitiveness,and South Korea comprehensively promotes the development and technological innovation of the semiconductor industry.Based on these findings,this paper summarizes the implications of the global economies'layouts in the semiconductor field for China.

semiconductorsupply chainstrategic layouttechnology innovationindustrial development

李姣姣

展开 >

中国科学院科技战略咨询研究院,北京 100190

中国信息通信研究院,北京 100191

半导体 供应链 战略布局 技术创新 产业发展

2024

全球科技经济瞭望
中国科学技术信息研究所(ISTIC) 科学技术文献出版社

全球科技经济瞭望

CSTPCDCHSSCD
影响因子:0.359
ISSN:1009-8623
年,卷(期):2024.39(7)