As advanced process technology iterates to 5nm and 3nm,the effect of Moore's Law gradually slows down,and the cost and complexity of process development continue to rise.In the background of challenges such as chip cooling,transmission bandwidth and manufacturing yield,the performance improvement of a single chip has encountered bottlenecks such as"power consumption walls","storage walls"and"area walls".The emergence of Chiplet technology provides new solutions to this problem.This article provides an overview of the underlying packaging technology of Chiplet chips,elaborates on the current development status of advanced packaging in China,and puts forward suggestions for the development of advanced packaging in China.
NETL
NSTL
万方数据
