金刚石化学机械抛光研究进展
Research Progress in Chemical Mechanical Polishing of Diamond
安康 1许光宇 1吴海平 1张亚琛 1张永康 1李利军 1李鸿 1张旭芳 2刘峰斌 1李成明3
作者信息
- 1. 北方工业大学机械与材料工程学院,北京 100144
- 2. 北方工业大学信息学院,北京 100144
- 3. 北京科技大学新材料技术研究院,北京 100083
- 折叠
摘要
金刚石以优异的性能在力学、光学、热学和电子学(如半导体)等领域发挥着重要作用.然而,金刚石表面质量会影响其在这些领域的应用效果,因此通过高效抛光技术获得高质量表面一直是金刚石研究的重点内容.金刚石抛光技术主要有机械抛光、热化学抛光、激光抛光和化学机械抛光等,其中化学机械抛光(CMP)具有设备运行成本低、工艺简单、抛光后表面损伤小等优点.本文在对上述几种抛光方法进行分析对比的基础上,聚焦于CMP领域,对其发展历程进行了较详尽的对比与分析.早期CMP技术虽在工艺和抛光效率上存在一定局限,但为后续技术的创新与优化奠定了基础;H2O2及其混合物的应用,不仅增强了 CMP过程中的化学反应活性,提高了材料去除率,还有效降低了表面粗糙度,改善了金刚石表面质量;光催化辅助化学机械抛光可使金刚石达到高表面质量,但设备相对复杂,无法满足大规模生产的需求,需要进一步研究和优化.此外,本文还对化学机械抛光的未来发展进行了预测,为相关领域研究人员提供参考.
Abstract
Diamond plays a significant role in the fields of mechanics,optics,thermology and electronics(such as semiconductors)with its excellent properties.However,the surface quality of diamond affects its application in these areas.Therefore,obtaining high-quality surfaces through efficient polishing technology has always been a focus of diamond research.The main diamond polishing technologies include mechanical polishing,thermochemical polishing,laser polishing and chemical mechanical polishing,among which chemical mechanical polishing(CMP)has the advantages of low equipment operating costs,simple process,and minimal surface damage after polishing.Based on the analysis and comparison of the above polishing methods,this paper focuses on the field of CMP and makes a detailed comparison and analysis of its development history.Although the early CMP technology had certain limitations in process and polishing efficiency,it lays the foundation for the innovation and optimization of the subsequent technology;the application of H2O2 and its mixtures not only enhances the chemical reaction activity in the process of CMP and improves the material removal rate,but also effectively reduces the surface roughness and improves the surface quality of diamond;the photocatalytic assisted chemical mechanical polishing can enable diamond to achieve a high surface quality,but the equipment is relatively complicated and cannot meet the demand of mass production,which needs further research and optimization.In addition,this paper also predicts the future development of chemical mechanical polishing to provide reference for researchers in related fields.
关键词
金刚石/化学机械抛光/表面粗糙度/抛光液/去除机理Key words
diamond/chemical mechanical polishing/surface roughness/polishing solution/removal mechanism引用本文复制引用
基金项目
国家自然科学基金区域联合基金项目(U23A2025)
国家自然科学基金(52102034)
北方工业大学组织科研基金(2023YZZKY12)
出版年
2024
国家科技期刊平台
NSTL
万方数据