双酚A对环氧树脂固化反应的影响研究
Effect of bisphenol-A on the curing reaction of epoxy resin
王振镭 1李强利 2严初三 2潘跃武 2周浩波 2吴强1
作者信息
- 1. 浙江农林大学化学与材料工程学院,浙江 杭州 311300
- 2. 金安国纪科技(杭州)有限公司,浙江 杭州 311300
- 折叠
摘要
为优化覆铜板制作工艺,降低能耗,提高生产效率,在低分子质量环氧树脂(EP-44)与线性酚醛树脂固化体系(EPN)及EP-44/线性酚醛树脂/双氰胺协同固化体系(EPND)中添加双酚A(BPA)扩链,采用示差扫描量热(DSC)法研究了 BPA对2种体系固化反应的影响.结果表明,双酚A可小幅提升两种体系的固化特征温度,降低固化反应速率,降低固化产物的玻璃化转变温度(Tg).双氰胺可降低EPN-BPA体系的固化特征温度,提升反应速率,提高固化产物体系Tg.
Abstract
In order to optimize the production process of copper clad laminates,reduce energy consumption and improve production efficiency,the bisphenol A(BPA)was added to the low molecular weight epoxy resin(EP-44)and linear phenolic resin curing system(EPN),as well as the EP-44 and synergistic curing system of linear phenolic resin and dicyandiamide(EPND).The effects of BPA on t he curing reaction of the two systems were investigated using differential scanning calorimetry(DSC).The results indicated that BPA could slightly increase the curing characteristic temperature of both systems,reduce the curing reaction rate,and lower the glass transition temperature(Tg)of the cured products.The dicyandiamide could reduce the curing characteristic temperature of the EPN-BPA system,increase the reaction rate,and increase the Tg of the cured product system.
关键词
双酚A/环氧树脂/线性酚醛树脂/双氰胺/覆铜板/固化动力学Key words
bisphenol A/epoxy resin/linear phenolic resin/dicyandiamide/copper clad plate/curing kinetics引用本文复制引用
基金项目
浙江省教育厅一般项目(Y202353144)
出版年
2024
NETL
NSTL
万方数据