Effect of bisphenol-A on the curing reaction of epoxy resin
In order to optimize the production process of copper clad laminates,reduce energy consumption and improve production efficiency,the bisphenol A(BPA)was added to the low molecular weight epoxy resin(EP-44)and linear phenolic resin curing system(EPN),as well as the EP-44 and synergistic curing system of linear phenolic resin and dicyandiamide(EPND).The effects of BPA on t he curing reaction of the two systems were investigated using differential scanning calorimetry(DSC).The results indicated that BPA could slightly increase the curing characteristic temperature of both systems,reduce the curing reaction rate,and lower the glass transition temperature(Tg)of the cured products.The dicyandiamide could reduce the curing characteristic temperature of the EPN-BPA system,increase the reaction rate,and increase the Tg of the cured product system.
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