微胶囊型单组分环氧树脂胶粘剂的制备及其力学性能研究
Preparation and mechanical properties of microencapsulated one-component epoxy resin adhesive
安金亮 1汤胜 2孙赛玲 3申兆波3
作者信息
- 1. 河北工程大学土木工程学院,河北 邯郸 056038;河北工程大学绿色功能材料研究所,河北 邯郸 056038
- 2. 河北工程大学土木工程学院,河北 邯郸 056038
- 3. 广州市香港科大霍英东研究院工程材料及可靠性研究中心,广东 广州 511458
- 折叠
摘要
以酚醛胺(T31)固化剂为芯材,聚脲(PUA)为壳材,采用界面聚合法制备了一种微胶囊型固化剂T31-PUA.通过热重分析仪、扫描电子显微镜对微胶囊的热稳定性、微观形貌进行了表征.将固化剂微胶囊与环氧树脂混合制备成单组分胶粘剂,利用示差扫描量热仪、万能试验机对单组分胶粘剂的固化特性、耐久性能及力学性能进行表征.结果表明:微胶囊表面略有粗糙,平均粒径为150 µm,芯材质量分数为60％.微胶囊在室温下压力解封,可在1h内完成固化,其粘接件拉伸剪切强度为6.18 MPa.热解封可在120℃下30 min内固化,其粘接件拉伸剪切强度为6.95 MPa.该微胶囊型单组分胶粘剂室温储存期可达40 d以上,固化特性、耐久性和力学性能良好.
Abstract
The T31-PUA(m)icrocapsule curing agent was prepared by interfacial polymerization using phenolic amine(T31)curing agent as core material and polyurea(PUA)as shell material.Thermogravimetric analyzer and scanning electron microscope were used to characterize the thermal stability and microstructure of the microcapsules.A single component adhesive was prepared by mixing the curing agent microcapsule with epoxy resin.The curing properties,durability and mechanical properties of the single component adhesive were characterized by differential scanning calorimeter and universal testing machine.The results showed that the surface of the microcapsules was slightly rough,the average particle size was 150 μm,and the core material content was 60 wt％.The microcapsule was unsealed at room temperature and cured within 1 h.The tensile shear strength of the adhesive was 6.18 MPa.Under pyrolytic unsealing,the adhesive could be cured within 30 min at 120 ℃,and the tensile shear strength of the adhesive was 6.95 MPa.The microencapsulated single component adhesive had a storage period of more than 40 days at room temperature,and had good curing characteristics,durability and mechanical properties.
关键词
微胶囊固化剂/酚醛胺/聚脲/环氧树脂/单组分胶粘剂/拉伸剪切强度Key words
microcapsule curing agent/phenolic amine/polyurea/epoxy resin/single component adhesive/tensile shear strength引用本文复制引用
基金项目
河北省高等学校科学技术研究项目(QN2022155)
河北工程大学博士专项(SJ2101003140)
广东省科技厅港澳科技来粤转化项目(2022A0505030023)
出版年
2024
NETL
NSTL
万方数据