Preparation and mechanical properties of microencapsulated one-component epoxy resin adhesive
The T31-PUA(m)icrocapsule curing agent was prepared by interfacial polymerization using phenolic amine(T31)curing agent as core material and polyurea(PUA)as shell material.Thermogravimetric analyzer and scanning electron microscope were used to characterize the thermal stability and microstructure of the microcapsules.A single component adhesive was prepared by mixing the curing agent microcapsule with epoxy resin.The curing properties,durability and mechanical properties of the single component adhesive were characterized by differential scanning calorimeter and universal testing machine.The results showed that the surface of the microcapsules was slightly rough,the average particle size was 150 μm,and the core material content was 60 wt％.The microcapsule was unsealed at room temperature and cured within 1 h.The tensile shear strength of the adhesive was 6.18 MPa.Under pyrolytic unsealing,the adhesive could be cured within 30 min at 120 ℃,and the tensile shear strength of the adhesive was 6.95 MPa.The microencapsulated single component adhesive had a storage period of more than 40 days at room temperature,and had good curing characteristics,durability and mechanical properties.
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