Preparation of powdered aromatic polyimide metal composite binder
In order to solve the problems of low heat resistance and poor temperature matching with low melting point metals in tradition-al resin binders,polyimide resin(PI)was prepared by two-step synthesis method using 2,2'-bis[4-(4-aminophenoxy)phenyl]propane(BAPP)and phthalic anhydride(PMDA)as monomers.By adjusting the reaction parameters,it was found that the feeding order was amine followed by anhydride,and the reaction time was 6 h.When the molar ratio of monomer PMDA to BAPP was 1.02:1,the molecular weight of PI was optimal.It had good mechanical properties(pure PI binder with a flexural strength of 95 MPa)and thermal stability(initial decomposition temperature of about 510 ℃).When preparing composite binders with low melting point copper alloys,it had good temperature matching and heat resistance.When the resin volume fraction was 10％,the flexural strength of PI and polyamide acid composite binder was 532 MPa and 540 MPa,respectively,with better comprehensive performance.
polyimidehigh temperature resistancecomposite binderlow melting point metal alloyflexural strengththermal stability
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