首页|二酐结构对苯乙炔基封端聚酰亚胺性能的影响

二酐结构对苯乙炔基封端聚酰亚胺性能的影响

扫码查看
分别采用2,3,3',4'-联苯四甲酸二酐(α-BPDA)、六氟二酐(6FDA)、4,4'-氧双邻苯二甲酸酐(ODPA)、3,3',4,4'-二苯甲酮四甲酸二酐(BTDA)四种二酐单体,与二胺单体及苯乙炔基封端剂合成不同分子结构的热固性聚酰亚胺树脂(PI).采用FTIR、XRD、流变、DMA、TGA等表征分析方法研究了不同二酐结构对热固性聚酰亚胺理化性能的影响及其机理.结果表明,二酐结构对聚酰亚胺树脂玻璃化转变温度及热氧化稳定性影响明显,分子链刚性、稳定性较好的α-BPDA及BTDA合成的PI具有较高的玻璃化转变温度与热分解温度,醚键结构有利于降低树脂粘度.基于非对称扭曲联苯结构的α-BPDA合成的PI最低熔体粘度为0.81 Pa·s,Tg为322℃,5%热分解温度(空气)为534℃,兼具较好的工艺性能和耐热性能.
Effect of dianhydride structure on the properties of phenylacetylene terminated polyimide
The thermosetting polyimide resins(PI)with different molecular structures were synthesized by four monomers of 2,3,3',4'-biphenyltetracarboxylicdianhydride(α-BPDA),hexafluorodianhydride(6FDA),4,4'-oxydiphthalicanhydride(ODPA),3,3',4,4'-benzophenonetetracarboxylicdianhydride(BTDA)along with diamine monomers and phenylacetylene based end capping agents.By means of FTIR,XRD,DMA,rheology,TGA test,the effects of different dianhydride structures on physical and chemical properties of thermosetting polyimides were studied.The results indicated that the structure of dianhydride had a significant effect on the glass transition temperature and thermal oxidation stability of polyimide resin.The PI synthesized by α-BPDA and BTDA with rigid molecular chain and good stability had higher glass transition temperature and thermal decomposition temperature.The ether bond structure was beneficial to reduce the viscosity of the resin.The PI synthesized by α-BPDA with asymmetric twisted biphenyl structure had good process performance and heat resistance,the minimum melt viscosity,glass transition temperature and 5%thermal decomposition temperature(in air)was 0.81 Pa·s,322 ℃,and 534 ℃,respectively.

polyimidethermosettingdianhydrideviscosityglass transition temperaturethermal oxidation stability

姚逸伦、张朋、包建文、杨涛

展开 >

中国航空制造技术研究院航空工业复合材料技术中心先进复合材料重点实验室,北京 101300

聚酰亚胺 二酐 热固性 粘度 玻璃化转变温度 热氧化稳定性

2024

热固性树脂
天津市合成材料工业研究所

热固性树脂

CSTPCD
影响因子:0.363
ISSN:1002-7432
年,卷(期):2024.39(3)