Effect of curing temperature on properties of epoxy resin insulation build-up films for packaging substrates
The epoxy resin insulating build-up film is the core and key material of many advanced packaging technologies including FCBGA packaging substrate,and its performance is directly affected by the curing process.To investigate the influence of curing temperature on the properties of epoxy resin insulation build-up film,the curing degree,surface roughness and peel strength of samples pre-cured at 170,180 and 190℃were tested.The results showed that with the increase of pre-curing temperature,the curing degree of the sample showed a steady upward trend,while the surface roughness decreased after Desmear treatment.With the increase of pre-curing temperature,the minimum peel strength of ABF-T31 decreased,while that of NBF-T23 increased first and then decreased,which may be due to the low curing degree at 170 ℃,resulting in defects after Desmear treatment and affecting the peel strength.
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