Curing kinetics and properties tuning of epoxy resin/DDS high heat-resistant resin system
The 128/9721/DDS epoxy curing system was prepared using a composite resin of bisphenol A epoxy resin CY128 and tetrafunctional epoxy resin XB9721 as the matrix,and 4,4'-diaminodiphenylsulfone(DDS)as the curing agent.The curing kinetics of the system was investigated by non isothermal differential scanning calorimetry(DSC),and the effects of factors such as the uniformity of the curing system and the amount of curing agent on the properties of the cured product were discussed.The results showed that the activation energy of the 128/9721/DDS system was 61.45 kJ/mol(Kissinger method),and the curing reaction was close to a first-order reaction.When the curing temperature was below 90 ℃,the reaction rate constant of the system was basically unchanged.When the temperature exceeded 150 ℃,the curing reaction rate constant increased rapidly.Compared with the dispersion method,dissolving DDS powder in epoxy resin could improve the uniformity of the curing system,thereby significantly increase the tensile strength of the cured product,and reduce the fluctuation of tensile strength.The mechanical and thermal properties of the curing system could be controlled by changing the amount of DDS and post curing treatment.
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