Preparation of high heat-resistance electronic packaging molding compound based on phthalonitrile resin
The electronic packaging molding compound(AEM)was prepared with 4-aminophenoxy-o-phthalonitrile(APN)and multifunctional epoxy resin as matrix resins,2-methylimidazole as curing accelerator,and inorganic fillers.The thermal properties,mechanical properties,aging resistance,dielectric properties and flame retardancy of AEM were tested and compared with those of commercial epoxy molding compound(EMC).The molding process of AEM was compatible with that of EMC.The cured AEM exhibited excellent high temperature stability(Tg＞230 ℃)and high temperature aging resistance(200 ° C,500 h)compared with the cured EMC.In addition,the cured AEM had low dielectric constant and dielectric loss,exhibiting a good electrical insulation.It was important to note that the cured AEM exhibited a good flame-retardant performance without the addition of flame retardant,and could reach V-0 rating in UL-94 testing.The molding compound has a good application prospect in the field of power device packaging.
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