Synthesis of phenolic hydroxyl-containing polysiloxane and its modification of epoxy resin
A phenolic hydroxyl-containing polysiloxane(poly DMS-alt-BPA)was synthesized by silicon-hydrogen addition reac-tion,and its chemical structure was characterized by FT-IR and 1H-NMR.Furthermore,the poly(DMS-alt-BPA)was added as a modifier to bisphenol A epoxy resin(E51)/methylhexahydrophthalic anhydride(MeHHPA)curing system.The curing behavior of the system and the thermal stability,thermal-mechanical properties,and mechanical properties of the cured material were studied.The results showed that the poly(DMS-alt-BPA)could participate in the curing reaction of the system,and scarcely affected the curing behavior.The addition of poly(DMS-alt-BPA)could effectively toughen the epoxy thermosets,while the materials maintained a high glass transition temperature and thermal stability.Compared with pure epoxy thermoset,the flexural strength and impact strength of cured epoxy resins containing 10 wt％poly(DMS-alt-BPA)increased by 70％and 117.9％,respectively,but the flexural modulus decreased.Therefore,as a new toughening agent,the poly(DMS-alt-BPA)has good application prospect in the field of electronic packaging materials.
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