酚羟基聚硅氧烷的合成及其对环氧树脂的改性
Synthesis of phenolic hydroxyl-containing polysiloxane and its modification of epoxy resin
谢凯丽 1黄家腾 1李珍珍 1刘敬成 1李小杰 1魏玮1
作者信息
- 1. 江南大学化学与材料工程学院,江苏 无锡 214122
- 折叠
摘要
利用硅氢加成反应合成了一种酚羟基聚硅氧烷(poly(DMS-alt-BPA)),采用红外光谱、核磁共振氢谱对其化学结构进行了表征.进一步将其作为改性剂添加到双酚A型环氧树脂(E51)/甲基六氢苯酐(MeHHPA)固化体系中,对体系的固化行为及固化物的热稳定性、热机械性能、力学性能进行了研究.结果表明,poly(DMS-alt-BPA)可以参与体系的固化反应,且不会明显影响固化行为.poly(DMS-alt-BPA)的加入可有效增韧环氧树脂固化物,同时固化物能够保持较高的玻璃化转变温度和热稳定性.与纯的环氧树脂固化物相比,含有质量分数10％poly(DMS-alt-BPA)的环氧树脂固化物的弯曲强度和冲击强度分别提升了 70％和117.9％,但弯曲模量有所降低.因此,poly(DMS-alt-BPA)作为一种新型增韧剂在电子封装材料领域具有良好的应用前景.
Abstract
A phenolic hydroxyl-containing polysiloxane(poly DMS-alt-BPA)was synthesized by silicon-hydrogen addition reac-tion,and its chemical structure was characterized by FT-IR and 1H-NMR.Furthermore,the poly(DMS-alt-BPA)was added as a modifier to bisphenol A epoxy resin(E51)/methylhexahydrophthalic anhydride(MeHHPA)curing system.The curing behavior of the system and the thermal stability,thermal-mechanical properties,and mechanical properties of the cured material were studied.The results showed that the poly(DMS-alt-BPA)could participate in the curing reaction of the system,and scarcely affected the curing behavior.The addition of poly(DMS-alt-BPA)could effectively toughen the epoxy thermosets,while the materials maintained a high glass transition temperature and thermal stability.Compared with pure epoxy thermoset,the flexural strength and impact strength of cured epoxy resins containing 10 wt％poly(DMS-alt-BPA)increased by 70％and 117.9％,respectively,but the flexural modulus decreased.Therefore,as a new toughening agent,the poly(DMS-alt-BPA)has good application prospect in the field of electronic packaging materials.
关键词
酚羟基聚硅氧烷/环氧树脂/酸酐/电子封装/增韧/耐热性Key words
phenolic hydroxyl-containing polysiloxane/epoxy resin/anhydride/electronic packaging/toughening/heat resistance引用本文复制引用
基金项目
2018年江苏省产学研合作项目(BY 218041)
出版年
2024
NETL
NSTL
万方数据