Preparation and characterization of high thermal conductivity and high speed copper clad plate
Inorder to improve the themal conductivity of copper clad laminate,the epoxy copper clad plate were prepared by using SiO2 as the main filler and adding Al2O3 with high thermal conductivity.The effects of Al2O3 content and particle size on the thermal conductivity,dielectric properties,peel strength,breakdown voltage,and other properties of the copper clad plate were explored.The results indicate d that when the total mass fraction of the filler was 80％,in which the mass fraction of SiO2 was 80％and the mass fraction of Al2O3 was 20％,and the mass ratio of Al2O3 with 5 μm and 10µm particle size was 1∶1,the thermal conductivity of the prepared copper clad plate was 1.39 W/(m·K).The dielectric constant(Dk)and dielectric loss tangent(Df)was 3.61 and 0.01 at 10 GHz,resprctively.Additionally,the breakdown voltage was 7.02 kV(100 μm),and the peel strength was 1.12 N/mm.It met the requirements of high thermal conductivity and high speed copper clad plate.
high thermal conductivitylow dielectrichigh speed copper clad plate
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