高导热高速覆铜板的制备及表征
Preparation and characterization of high thermal conductivity and high speed copper clad plate
夏婷 1李会录 1苏建锋 1严玉茹 1王超 1刘卫清2
作者信息
- 1. 西安科技大学材料学院,陕西 西安 710054
- 2. 西安天和嘉膜工业材料有限责任公司,陕西 西安 710054
- 折叠
摘要
为提高覆铜板的导热性能,以SiO2为主要填料,同时添加高导热Al2O3制备了环氧覆铜板,探究Al2O3的含量、粒径对覆铜板的导热、介电性能、剥离强度及击穿电压等性能的影响.结果表明,填料总填充质量分数为80％,其中SiO2质量分数为80％,Al2O3质量分数为20％且5 pm与10 µm粒径的Al2O3质量比为1∶1时,制备的覆铜板的导热率为1.39W/(m·K),10 GHz下介电常数(Dk)为3.61,介电损耗(Df)为0.01,击穿电压为7.02 kV(100 μm),剥离强度为1.12 N/mm,达到高导热高速覆铜板的要求.
Abstract
Inorder to improve the themal conductivity of copper clad laminate,the epoxy copper clad plate were prepared by using SiO2 as the main filler and adding Al2O3 with high thermal conductivity.The effects of Al2O3 content and particle size on the thermal conductivity,dielectric properties,peel strength,breakdown voltage,and other properties of the copper clad plate were explored.The results indicate d that when the total mass fraction of the filler was 80％,in which the mass fraction of SiO2 was 80％and the mass fraction of Al2O3 was 20％,and the mass ratio of Al2O3 with 5 μm and 10µm particle size was 1∶1,the thermal conductivity of the prepared copper clad plate was 1.39 W/(m·K).The dielectric constant(Dk)and dielectric loss tangent(Df)was 3.61 and 0.01 at 10 GHz,resprctively.Additionally,the breakdown voltage was 7.02 kV(100 μm),and the peel strength was 1.12 N/mm.It met the requirements of high thermal conductivity and high speed copper clad plate.
关键词
高导热/低介电/高速覆铜板Key words
high thermal conductivity/low dielectric/high speed copper clad plate引用本文复制引用
出版年
2024
NETL
NSTL
万方数据