高频覆铜板用氰酸酯/苯并恶嗪/环氧体系的研究
Cyanate/benzoxazine/epoxy system for high frequency copper clad laminate
沈明琦 1秦会斌1
作者信息
- 1. 杭州电子科技大学新型电子器件与应用研究所,浙江 杭州 310018
- 折叠
摘要
在双环戊二烯型氰酸酯(DCPD-CE)中添加了不同质量分数的双酚F型苯并恶嗪(BPF-BZ)与聚氨酯改性环氧树脂(PU-EP)得到三元共混体系,通过傅里叶变换红外光谱(FTIR)、示差扫描量热分析(DSC)研究了三种树脂对体系固化反应的影响.以此三元共混体系为基体制备了覆铜板,并对覆铜板的介电性能、剥离强度、热稳定性、吸水率进行了测试.结果表明:当DCPD-CE、BPF-BZ和PU-EP的质量分数分别为70％、10％和20％时,体系的综合性能最佳,此时T5％可达412℃,10 GHz下覆铜板的介电常数为3.67,介电损耗为0.006 2,沸水中放置24 h的吸湿率小于1％.随着BPF-BZ含量的增加,体系的综合性能下降,但是覆铜板的剥离强度得到提升.
Abstract
The bisphenol F benzoxazine(BPF-BZ)and polyurethanemodified epoxy resin(PU-EP)with different mass fractions were added to the dicyclopentadiene cyanate(DCPD-CE)and the ternary blending system was obtained.Their effects on the curing reaction of the system were studied by fourier transform infrared spectroscopy(FTIR)and differential scanning calorimetric analysis(DSC).The copper clad laminate(CCL)was prepared with the ternary blending system as the matrix,and the dielectric properties,peel strength,thermal stability and wateruptakerate of the CCL were tested.The results showed that when the mass fractions of DCPD-CE,BPF-BZ and PU-EP were 70％,10％and 20％,respectively,the comprehensive performance of the system was the best.At this time,the T5％could reach 412℃.At 10 GHz the dielectric constant was 3.67 and the dielectric loss was 0.006 2.The water uptake rate was less than 1％in boiling water for 24 h.With the increase of BPF-BZ content,the comprehensive performance of the system could be decreased,but the peel strength of the CCL could be improved.
关键词
双环戊二烯型氰酸酯/双酚F型苯并恶嗪/聚氨酯改性环氧树脂/固化反应/覆铜板/介电性能/剥离强度/热稳定性Key words
dicyclopentadiene cyanate/bisphenol F benzoxazine/polyurethane modified epoxy resin/curing reaction/copper clad laminate/dielectric property/peel strength/thermal stability引用本文复制引用
出版年
2024
NETL
NSTL
万方数据