Design and performance of high heat-resistant copper-clad plate
The ternary blending system was obtained by adding different proportions of biphenyl epoxy resin(YX4000)and polyurethane modified epoxy resin(SL3403)to bisphenol F epoxy resin.The curing reactions and heat resistance of the blended system were studied by infrared spectroscopy and glass transition temperature test.The copper clad laminates were prepared by adding alumina with different particle sizes in the ternary blending system,and the thermal stability,heat resistance,peel strength and voltage resistance of the copper clad laminates were tested.The results showed that when the mass fractions of YX4000 and SL3403 in the resin system was both 20％,the overall performance of the system was the best.In this case,the Tg,5％weight loss temperature,tin bleaching time of the copper-clad board at 288 ℃,peel strength and breakdown voltage was 195 ℃,381 ℃,1 023 s,1.305 N/mm and 49 V/μ,respectively.
copper clad laminatebiphenyl epoxy resinpolyurethanethermal stabilityhigh temperature resistancepeel strength
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