首页|改性氰酸酯树脂胶粘剂研究进展

改性氰酸酯树脂胶粘剂研究进展

扫码查看
介绍了氰酸酯胶粘剂的粘接机理,综述了采用过渡金属化合物和活泼氢化合物降低CE固化温度以及采用热塑性树脂、热固性树脂、橡胶弹性体及纳米颗粒增韧提高CE胶粘剂粘结强度的研究进展,并对CE胶粘剂发展前景进行了展望.
Research progress in modified cyanate ester adhesives
The bonding mechanism of cyanate ester adhesive was introduced.The research progresses in using transition metal compounds and active hydrogen compounds to reduce the curing temperature of CE and using thermoplastic resin,thermosetting resin,rubber elastomer and nanoparticles to toughen and improve the bonding strength of CE adhesive were reviewed.The development prospect of CE adhesive was prospected.

high temperature resistancecyanate esteradhesivebonding mechanismcuring temperaturetoughening

柏安江、秦雨、蔡璐、赵永龙、章家立

展开 >

华东交通大学材料科学与工程学院,江西 南昌 330000

耐高温 氰酸酯 胶粘剂 粘接机理 固化温度 增韧

2024

热固性树脂
天津市合成材料工业研究所

热固性树脂

CSTPCD
影响因子:0.363
ISSN:1002-7432
年,卷(期):2024.39(6)