Wafer chip detection plays a crucial role in the wafer processing and production process.To address the limitations of long time and low accuracy in wafer chip detection in industrial production processes,an improved multi-objective template matching algorithm based on machine vision combined with non maximum suppression algorithm is proposed.This algorithm utilizes the nearest neighbor bounding rectan-gle algorithm to obtain the rectangular contour that best fits the chip,accurately obtaining the template of the rectangular chip;For chip sur-face contamination that affects template matching,a grayscale compensation method combined with morphological improvement is adopted to reduce the impact of grayscale values in the contaminated area on the matching results.The experimental results show that the recognition rate of the proposed multi-objective template matching algorithm is over 95％,and the time consumption does not exceed 0.5 seconds;The nearest neighbor bounding rectangle algorithm is more accurate than the traditional minimum bounding rectangle algorithm,providing a feasible solu-tion for industrial wafer chip detection.
维普
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