首页|电磁制动下CSP结晶器内流动与传热特性研究

电磁制动下CSP结晶器内流动与传热特性研究

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以薄板坯连铸连轧(compact strip production,CSP)漏斗形结晶器为研究对象,利用建立的三维多场数学模型,研究全幅一段电磁制动作用下电磁参数对CSP漏斗形结晶器内钢液流动、传热及凝固行为的影响.结果表明:施加全幅一段电磁制动后,水平磁极产生的电磁力可提高弯月面附近区域钢液温度分布的均匀性,促进表面化渣.当全幅一段电磁制动施加的磁感应强度达到0.30 T时,CSP薄板坯连铸结晶器钢液的流动控制效果与传热效果较好.而当磁感应强度继续增加至0.50 T时,水平磁极产生的电磁力对结晶器内水口出流的钢液流动抑制过强,反而导致上回流钢液流速增加,钢液热量传递速度加快,上回流区钢液温度分布均匀性有所降低.
Investigation of flow and heat transfer characteristics in CSP mold with electromagnetic braking
Taking the compact strip production(CSP)funnel-shaped mold as research object,a three-dimensional multi-field coupling mathematical model was established to describe electromagnetic braking(EMBr)continuous casting process and to investigate the effects of electromagnetic parameters on the behavior of molten steel flow,heat transfer,and solidification in the CSP mold.The results indicate that the Lorentz force generated by the Ruler-EMBr can improve the uniformity of molten steel temperature distribution near the meniscus region.This is beneficial to improving the fluidity of molten steel and promote the melting of mold flux.The parametric study also shows that the flow control and heat transfer capability of molten steel in the CSP mold can be well improved with the magnetic flux density of 0.30 T.However,when the magnetic flux density continues to increase to 0.50 T,the jet flow discharged from a submerged entry nozzle is excessively suppressed by the Lorentz force,resulting in an increase in the velocity and heat transfer rate of the upward backflow.Correspondingly,the uniformity of molten steel temperature distribution in the upper recirculation region of CSP mold is decreased.

electromagnetic brakingCSP moldmolten steel flowheat transfer and solidification

许琳、裴群武、李楠、徐鹤源、杨硕、潘宏刚、姚彦桃

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沈阳工程学院能源与动力学院,辽宁沈阳 110136

沈阳仪表科学研究院有限公司,辽宁沈阳 110043

辽宁石油化工大学环境与安全工程学院,辽宁抚顺 113001

电磁制动 CSP结晶器 钢液流动 传热凝固

国家自然科学基金资助项目辽宁省博士科研启动基金资助项目辽宁省教育厅科研资助项目辽宁省教育厅科研资助项目沈阳市科技人才专项资助项目

519010952022-BS-224LJKQZ20222282LJKMZ20221713RC230046

2024

热科学与技术
大连理工大学

热科学与技术

CSTPCD北大核心
影响因子:0.463
ISSN:1671-8097
年,卷(期):2024.23(1)
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