Study on the coupling characteristics of thermal-fluid-solid under constant flow distribution in 3D-IC double-layer microchannels
In the process of the rapid development of three-dimensional integrated circuit technology(3D-IC),with the continuous rise of the heating power,heat dissipation has become a key problem.Interlayer microchannel technology is an effective way to solve the problem.Based on the real processor structure,a double-layer microchannel model is established,and the flow and heat transfer characteristics and thermal stress distribution in the double-layer channel are studied.The effects of five different velocity rationing schemes on the temperature difference,pressure drop and thermal stress distribution between different layers are discussed.The results show that under the condition of constant velocity at the entrance of the upper and lower microchannel,the maximum stress is concentrated at the connection between the needle rib and the SiO2 layer near the exit of the channel.By changing the velocity distribution of the interlayer microchannel,the temperature difference at the exit of the interlayer is reduced by 5.24 K,and the temperature uniformity is improved.Meanwhile,the maximum thermal stress is 23％lower than that of the original scheme.
NETL
NSTL
万方数据
维普
