钨铜复合材料制备工艺研究
Study on Preparation Process of W-Cu Composite Materials
李乃拥 1王芦燕 1刘山宇1
作者信息
- 1. 北矿新材科技有限公司,北京 102206;矿冶科技集团有限公司,北京 100160
- 折叠
摘要
分别采用直接机械合金化法及氧化物共还原法制备了 W-10Cu和W-20Cu复合材料,研究了钨粉粒度、烧结温度和保温时间对钨铜合金显微组织、致密度和电导率的影响.结果表明:随着W粉粒度的增大,直接机械合金化法制备的钨铜合金组织中W晶粒逐渐增大,致密度逐渐降低,电导率逐渐增大.在相同烧结条件下,氧化物共还原法较直接机械合金化法制备的钨铜合金组织中W晶粒尺寸细小,分布均匀,致密度和电导率更高.随着烧结温度的升高,钨铜合金组织中W晶粒尺寸逐渐增大,致密度和电导率逐渐增加.当烧结温度由1 500 ℃增加至1 600 ℃时,氧化物共还原法制备的W-10Cu合金中W平均晶粒尺寸由2.1μm增加至3.6 μm,致密度由98.2％增加至98.5％,电导率由39.3％IACS增加至39.8％IACS;W-20Cu合金中W平均晶粒尺寸由2.3μm增加至3.5 μm,致密度由98.4％增加至99.2％,电导率由40.8％IACS增加至41.6％IACS.此外,钨铜合金组织中W晶粒尺寸随着保温时间的增加而逐渐增大.
Abstract
W-10Cu and W-20Cu composite materials were prepared by direct mechanical alloying and oxide co-reduction methods,respectively.The effects of W powder particle size,sintering temperature,and holding time on the microstructure,density,and conductivity of W-Cu alloy were studied.The results show that with the increase of W powder particle size,the W grain size in the W-Cu alloy prepared by direct mechanical alloying method increases gradually,the density drops gradually,and the conductivity increases gradually.Under the same sintering conditions,compared to the direct mechanical alloying method,the W-Cu alloys prepared by the oxide co-reduction method has smaller W grain size,uniform distribution,higher density and conductivity.With the increases of sintering temperature,the W grain size in the W-Cu alloy increases gradually,the relative density and conductivity increase gradually.When the sintering temperature increases from 1 500 ℃ to 1 600 ℃,the average grain size of W in W-l0Cu alloy prepared by oxide co-reduction method increases from 2.1 μm to 3.6 μm,the density increases from 98.2％to 98.5％,and the conductivity increases from 39.3％1ACS to 39.8％IACS.The average grain size of W in W-20Cu alloy increases from 2.3 μm to 3.5 μm,the density increases from 98.4％to 99.2％,and the conductivity increases from 40.8％IACS to 41.6％IACS.In addition,the W grain size in the microstructure of W-Cu alloy increases gradually with the increase of holding time.
关键词
钨铜复合材料/机械合金化/氧化物共还原/显微组织/致密度/电导率Key words
W-Cu composite material/mechanical alloying/oxideco-reduction/microstructure/relative density/conductivity引用本文复制引用
出版年
2024
NETL
NSTL
万方数据