Preparation and Properties of Organosilicon Modified Phenolic Resin Composite Materials
This article investigates the preparation and properties of organic silicon modified phenolic resin composite materials.Firstly,prepare the organic silicon modified phenolic resin composite material.Dissolve 4 g of methylphenyldimethoxysilane in 25 mL of tetramethylammonium hydroxide,then add the resulting solution to deionized water and stir to obtain a yellow solid.Place it in a 60℃oven for 24 hours to obtain the organic silicon modified phenolic resin composite material.Furthermore,the thermal properties and interlayer shear strength of organosilicon modified phenolic resin composite materials were tested.The research results show that when the mass ratio of cured epoxy resin to curing agent is 95:5,the performance of the organic silicon modified phenolic resin composite material is optimal.At this time,its interlayer shear strength is as high as 87.5 MPa,the thermal weight loss mass is 0.22 g,and the heat resistance is better.
NETL
NSTL
万方数据
