Study on the Treatment of Electroplating Wastewater Containing Copper by Silicate Molecular Sieve
Silicate molecular sieves are a kind of multi-purpose materials with adsorption,desorption,catalysis and ion exchange.In this paper,the effect of silicate molecular sieve dosage,adsorption time,temperature and pH on the removal rate of Cu ions was analyzed.Through the experimental analysis,the optimal treatment conditions were obtained:when the concentration of electroplating wastewater was 98.2 mg/L,the addition of silicate molecular sieve was 4 g/100 ml,the reasonable adsorption time was 30 min,and the effect of temperature was not significant.Room temperature 25℃could be selected as the treatment temperature,and the appropriate acid-base environment was pH 4~5,the reasonable mixing speed is 90 r/min.This study provides a theoretical basis for the actual electroplating wastewater treatment process.