摘要
研究了添加适量的Co元素对Sn-0.7Cu无铅钎料合金性能的影响,应用Axio Scope A1显微镜、差示扫描量热仪、MUST system3型可焊性测试仪、高温试验箱、HITACHI 550i型扫描电镜对Sn-0.7Cu-xCo(x=0％、0.002％、0.004％、0.02％、0.03％)合金焊料进行金相观察,并对其熔点、可焊性及可靠性能进行了对比试验分析.结果表明,加入一定量Co元素,使Sn-0.7Cu熔点增高,润湿性能有所降低,但金相组织和可靠性均得到改善.
Abstract
The effect of adding an appropriate amount of Co element on the properties of Sn-0.7Cu lead-free solder alloy was studied.The microstructure of Sn-0.7Cu xCo(x=0％,0.002％,0.004％,0.02％,0.03％)alloy solder was observed using Axio Scope A1 microscope,differential scanning calorimeter,FAST system 3 weldability tester,high-temperature test chamber,and HITACHI 550i scanning electron microscope,and the melting point,weldability,and reliability performance were compared and analyzed.The results showed that adding a certain amount of Co element increased the melting point of Sn-0.7Cu and reduced its wetting performance,but the metallographic structure and reliability were improved.
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