多孔钽材料与钽箔无压扩散焊连接的工艺研究
Research on the Process of Pressureless Diffusion Bonding Between Porous Tantalum Material and Tantalum Foil
李晓 1蒋春东 1吴杨同 1韩志青1
作者信息
- 1. 重庆介观医用多孔材料研究院,重庆 401120
- 折叠
摘要
针对多孔钽植入器件的稳固安装问题,提出了采用钽箔制作产品的连接结构,确立了 一种多孔钽材料与钽箔无压扩散焊连接的工艺方法,并成功制备出具有钽箔连接结构的颅骨板和颅骨锁多孔钽样品.经CT和SEM检测,该方法制备的多孔钽—钽箔连接件的连接区为冶金结合,无裂缝缺陷.
Abstract
In response to the problem of stable installation of porous tantalum implant devices,a connection structure using tantalum foil to make products was proposed.A process method of pressureless diffusion welding connection between porous tantalum material and tantalum foil was established,and porous tantalum samples with tantalum foil connection structure for skull plates and skull locks were successfully prepared.According to CT and SEM testing,the connection area of the porous tantalum tantalum foil connector prepared by this method is metallurgical bonding and has no crack defects.
关键词
多孔钽/钽箔/无压扩散焊Key words
porous tantalum/tantalum foil/pressure free diffusion welding引用本文复制引用
出版年
2024
NETL
NSTL
万方数据