Analysis and Improvement of Cracking of SK85 Steel Tape in Cold Pressing Forming
After observing the surface of the steel tape with the surface organic film removed,it was found that the crack location completely coincided with the scratch on the external radian surface,and the scratch occurred after the quenching process.Through SEM analysis,it was found that the crack source was located in the scratch area,which was subjected to tensile stress during the cold pressing stage,leading to the generation,propagation of the crack source,and ultimately complete cracking.
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