Optimization of Production Process for Ultra-thin Specification Patterned Board
By developing a special MSU compression model and a layer cooling CTC model for ultra-thin specification patterned plates,combined with optimization of core tension parameters,the problems of flatness and poor roll shape of ultra-thin specification patterned plates have been solved.The cutting rate of flat ≤ 2.0 mm specifications has been reduced by 3.08％,and the quality waste rate has been reduced by 3.79％.By optimizing the roller ratio and the pressure difference between the upper and lower rollers of the patterned roller,the problems of difficulty in groove removal and insufficient pattern height in ultra-thin patterned plates have been solved.Combined with a dedicated layer cooling CTC model and optimization of the layer cooling roller advance rate,the problem of head floating has been solved,reducing the risk of accidents and improving rolling stability.Through the successful development and integration of the leveling process,the proportion of thin specification patterned boards with normal shape before leveling has increased from 49％to 73％,and the proportion of boards with normal shape after leveling is over 94％.
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