Vacancy trapping during solidification of Cu50Ni50 alloy
Molecular dynamics(MD)simulation was used to investigate the vacancy trap-ping during the solidification and annealing processes of Cu50Ni50 at different temperatures.The results showed that the vacancy trapping effect was very evident and the vacancy con-centration significantly increased with the decrease in temperature,opposite to the law that the equilibrium concentration changes with temperature.There was a characteristic temperature T*for which the solidification rate rapidly increased with the decrease of tem-perature at shallow undercooling when T＞T*but decreased slowly at deep undercooling when T＜T*,indicating that the vacancy concentration was not a monotonic function of the interface moving rate.In addition,as an alloy constituent,Cu was found to be a better vacancy atom(VA)than Ni.
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