The three-dimensional(3D)heterogeneous integration is currently one of the most effective methods for system miniaturization and integration.In the highly integrated micro-scale environment,problems such as multi-chip integration,radio frequency(RF)channel design,electromagnetic compatibility,and RF performance testing are worth studying.In this paper,the RF-to-digital packaging design,RF channel design,electromagnetic shielding,and testing on ceramic and silicon substrates are studied with the 3D heterogeneous integration,along with 3D full-wave electromagnetic simulations and RF probe tests.A 20～40 GHz ultra-wideband RF-to-digital microsystem with 4 transmission and 16 reception(4T16R)channels is designed and implemented,and its basic indices are tested.
维普
万方数据