Research on Current Situation of Porous Wicking Soaking Plate
With the progress of the times and the continuous innovation of technology,electronic products are becoming smaller and thinner to meet people's needs,but their power consumption is constantly increasing.The smaller heat dissipation area and the larger power consumption make the control of chip heat flux and op-erating temperature very severe.Once the heat flow cannot be discharged in time,it will lead to poor perfor-mance and even burnout of the product.The soaking plate has excellent thermal conductivity,large heat trans-fer area,good temperature uniformity performance and high reliability,which is the primary way to solve the heat dissipation problem of electronic equipment.Based on this,an overview of the heat transfer principle of the soaking plate is summarized,focusing on the research status of the structural design of the soaking plate with porous material as the wicking core at home and abroad,including the gas-liquid channel layout structure and the selection of working medium.Some research methods and directions of porous material wicking core are introduced,and the current research results are analyzed.Finally,the future research trend and develop-ment prospects of the soaking plate are scientifically prospected.
Porous WickingGas-Liquid Distribution ChannelWorking Fluid SelectionPermeabilityCapil-lary Pressure
NETL
NSTL
万方数据
维普
