应用技术学报2024,Vol.24Issue(1) :43-47.DOI:10.3969/j.issn.2096-3424.2024.01.003

柔性PEDOT:PSS修饰Te纳米棒/PEDOT纳米线复合薄膜的制备及热电性能

Preparation and thermoelectric properties of flexible PEDOT:PSS coated Te nanorod/PEDOT nanowire composite films

杜永 郭思思 秦杰 孟秋风
应用技术学报2024,Vol.24Issue(1) :43-47.DOI:10.3969/j.issn.2096-3424.2024.01.003

柔性PEDOT:PSS修饰Te纳米棒/PEDOT纳米线复合薄膜的制备及热电性能

Preparation and thermoelectric properties of flexible PEDOT:PSS coated Te nanorod/PEDOT nanowire composite films

杜永 1郭思思 1秦杰 1孟秋风1
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作者信息

  • 1. 上海应用技术大学材料科学与工程学院,上海 201418
  • 折叠

摘要

通过改进的自组装胶束软模板法和湿化学法分别成功合成了聚(3,4-乙烯二氧噻吩)纳米线(PEDOT NW)和聚(3,4-乙烯二氧噻吩):聚苯乙烯磺酸(PEDOT:PSS)修饰的Te纳米棒(PC-Te),采用真空抽滤工艺制备了柔性自支撑PC-Te/PEDOT NW复合薄膜.通过透射电子显微镜等对PC-Te的显微结构进行表征,研究了PC-Te的添加量对复合薄膜的热电性能的影响规律.随着PC-Te含量的增加,复合薄膜的Seebeck系数增大,电导率减小,PC-Te含量为 70%时,复合薄膜的功率因子的最大值达到 47.4 μW/mK2(380 K).该薄膜具有良好的柔性,弯曲 500次后,其电阻变化率为9.2%.

Abstract

Poly(3,4-ethylenedioxythiophene)nanowire(PEDOT NW)and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate)(PEDOT:PSS)coated Te nanorods(PC-Te)were successfully synthesized through a modified self-assembled micellar soft-template process and a wet chemical method,respectively.Flexible self-supporting PC-Te/PEDOT NW composite films were prepared via a vacuum filtration technology.The microstructures of the PC-Te were characterized by the transmission electron microscopy,and the influence of PC-Te content on thermoelectric performance of the composite film was investigated.As the increase of PC-Te content,the Seebeck coefficient of the samples increased,and the electrical conductivity were decreased.The composite film with 70%PC-Te achieved a maximum power factor of 47.4 μW/mK2(380 K).The composite film showed good flexibility,and after bending for 500 times,the resistance change rate was 9.2%.

关键词

碲纳米棒/聚(3,4-乙烯二氧噻吩):聚苯乙烯磺酸/聚(3,4-乙烯二氧噻吩)纳米线/热电性能

Key words

Te nanorod/poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate)/poly(3,4-ethylenedioxy-thiophene)nanowire(PEDOT NW)/thermoelectric properties

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基金项目

上海市曙光计划(22SG54)

出版年

2024
应用技术学报
上海应用技术学院

应用技术学报

影响因子:0.195
ISSN:2096-3424
参考文献量15
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