With the continuous development of electronic technology,the heat generated by highly integrated and miniaturized electronic devices under high-frequency working conditions accumulates rapidly,which put forward higher requirements for their heat dissipation capabilities.Therefore,the design and synthesis of a material with excellent insulating and thermal conductivity was of great significance for the development of electronic technology.Polymer materials with excellent insulation and processing properties had attracted a lot of attention in the fields of microelectronics technology and high integrated circuits.The insulating and thermal conductive composite were prepared with polybutylene terephthalate(PBT)as the continuous phase,modified Boron nitride(BN-PDA),multi wall carbon nanotubes(MWCNTs)and other thermal conductive fillers as the dispersed phase.The experimental results indicated that a three-dimensional thermal conductivity network structure was formed inside the PBT/BN-PDA/MWCNTs composite,and the thermal conductivity was slightly higher than that of the PBT/BN-PDA@MWCNTs composite.The PBT/BN-PDA/MWCNTs composite material with 20％BN and 4％MWCNTs had the best comprehensive performance,with a thermal conductivity coefficient of 0.94 W/(m·K),which was not only 223.90％higher than pure PBT,but also met the electrical insulation and thermal requirements.
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