Experimental study on the effect of hollow glass beads on the properties of silicone potting adhesive with high thermal conductivity
In this experiment,two-component additive silicon gel was used as the main raw material,and alumina was used as the thermal conductive filler.Low dielectric and high thermal conductivity silicone potting adhesive was prepared by adding hollow glass beads and platinum catalyst.The mechanical properties,volume resistivity,thermal conductivity,breakdown voltage and low dielectric constant of thermal conductivity potting adhesive reinforced by hollow glass beads with different mass percentage were studied.The results show that the viscosity of potting adhesive increases gradually with the increase of hollow glass beads,and the thermal conductivity,specific gravity and dielectric constant decrease gradually.When the amount of hollow glass beads reached 3.0％,the thermal conductivity of potting glue was reduced to 0.9W/mK,and the dielectric constant was 4.186(1mhz).
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