The effects of special engineering plastics,such as,polyether ether ketone(PEEK),polyimide(PI),thermoplastic polyimide(TPI),polyphenylene sulfide(PPS),polysulfone(PSF),liquid crystal polymer(LCP),polyarylester(PAR)on the mechanical thermal and electrical properties of epoxy resins were studied in this paper.The engineering plastics with rigid and active elements produced differential phase in the epoxy curing process,which could absorb energy under stress,prevent microcrack diffusion,and improve the mechanical properties of epoxy resin,including tensile,compression and impact strength.Special engineering plastics with better heat resistance than epoxy resins are beneficial for improving the heat resistance of epoxy resins.During the epoxy curing process,strong intermolecular forces are generated between special engineering plastics and epoxy resin,which further enhances the heat resistance of modified epoxy resins.Better insulation of epoxy resin are achieved by adding engineering plastics with fine insulation equipment.PSF with poor dispersibility aggregates to form a weak interface layer,which first fails under stress,and its main mechanical properties slightly decrease.LCP and PAR are difficult to form a homogeneous phase in epoxy resin and cannot be used for epoxy resin modification research.
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